Alpha UP-78 is a No Clean solder paste with a post-reflow residue that is clear and colorless and is penetrable enough to allow easy ATE compatibility (pin testability). The residue is engineered to be soft and non-tacky to allow the lowest level of false rejects during pin testing. Alpha UP-78 is designed for stencil application and air reflow in surface mounting processes where post reflow cleaning is not required. Long stencil life and stable tack for minimum change in performance over 8 hour shifts under varying humidity exposure. Tolerant to a variety of reflow profiles for easy reflow on varying board designs. Highly penetrable residue to allow easy ATE compatibility (pin testing) and minimal false fails. Clear and colorless residue after reflow for the best board cosmetics. Application: For Standard and Fine Pitch Printing Through Stencil Apertures, Suitable For Use Across a Wide Variety of Process Settings, Including Rework Applications with BGA’s and Other Components, Especially Suitable for Printing on Assemblies That have OSP Coated Copper Pads
Ultrasonic Cleaning is based on a Cavitation Effect caused by high frequency ultrasonic wave vibrations in fluid. Microscopic bubbles are formed and they implode violently which causes Cavitation. This Cavitation gives out a great impact to the object(s) you are cleaning and provides an intense scrubbing action to the surface of the object. These bubbles are actually small enough to penetrate even microscopic crevices and cleans them thoroughly and consistently.
WHAT CAN YOU CLEAN WITH AN ULTRASONIC CLEANER?
You can clean any of the following objects with an Ultrasonic Cleaner: Jewelry, Dental & Surgical Instruments, Dentures, Lenses & Eye Glasses Automotive & Aviation Componets, Watches & Clockwork Parts, Ink Jet Cartridges, Computer Plotter Pens, Air Brushes – Spray Guns, Archival Papers, Calligraphic Pens, Laboratory Glassware, Metal Fibre Filters & Rubber Seals, Microelectronic Circuits & Small Components and Printed Circuit Boards.